Properties of Hylimide?TPI300 Corlorless Polyimide Film
Project |
Unit |
Property Index |
Test Condition |
Test Standard |
||||
Film Thickness |
µm |
12.5 |
25 |
50 |
23℃ |
ASTM D374 |
||
Glass-transition Temperature(Tg) |
℃ |
300 |
300 |
300 |
|
|
||
Optical Property |
Transmission |
% |
84 |
84 |
84 |
23℃ |
ASTM D1003 |
|
Transmission |
% |
88 |
88 |
88 |
23℃ |
ASTM D1003 |
||
Refractive(nTE) |
|
1.57 |
1.57 |
1.57 |
23℃ |
ASTM D1003 |
||
Refractive(nTM) |
|
1.55 |
1.55 |
1.55 |
23℃ |
ASTM D1003 |
||
Mechanical Property |
Ten.Strength |
MPa |
135 |
160 |
160 |
23℃ |
ASTM D882 |
|
Elongation |
% |
20 |
25 |
25 |
23℃ |
ASTM D882 |
||
Ten.Modulus |
GPa |
1.5 |
2.5 |
3 |
23℃ |
ASTM D882 |
||
Electrical Property |
Diel. Constant |
– |
3.3 |
3.3 |
3.3 |
1MHz 23℃ |
ASTM D150 |
|
Dielectric Dissipation Factor |
– |
0.007 |
0.007 |
0.007 |
1MHz 23℃ |
ASTM D150 |
||
Volume Resistivity |
Ω?cm |
>1014 |
>1014 |
>1014 |
500V 23℃ |
ASTM D257 |
||
Surface Resistivity |
Ω |
>1014 |
>1014 |
>1014 |
500V 23℃ |
ASTM D257 |
||
Dielectric Strength |
v/µm |
160 |
180 |
160 |
23℃ |
ASTM D149 |
||
Thermal Property |
CTE |
ppm/℃ |
20 |
20 |
20 |
100~200℃ |
ASTM D696 |
|
30 |
30 |
30 |
200-300℃ |
|||||
Dimensional Stab. |
% |
0.12 |
0.12 |
0.12 |
200℃,2Hr |
ASTM D5213–04 |
||
Physical Property |
Hygroscopicity |
% |
2.5 |
2.5 |
2.5 |
23℃,24Hr |
ASTM D570 |
|
Density |
g/cm3 |
1.38 |
1.38 |
1.38 |
23℃ |
ASTM D1505 |
||
Wetting Tension |
mN/m |
60 |
60 |
60 |
23℃ |
IEC674-2 |
||
Flame Retardant Grade |
|
VTM-0 |
VTM-0 |
VTM-0 |
Vertical Burning TEST |
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Chemical Property |
benzene |
Longitudinal Tension Retention(%) |
100 |
100 |
100 |
23℃ infiltrating for 10Min, |
ASTM D882 |
|
10%hydrochloric acid |
98 |
98 |
98 |
|||||
10%sulphuric acid |
97 |
97 |
97 |
|||||
5%sodium hydrate |
90 |
90 |
90 |